Location
Headquarters: New Albany, Indiana, United States, North America
Region: Indiana
Country: US
Continent: North America
About
Samtec is a global manufacturer and leader in electronic interconnects, specializing in connectors, cables, optics, and RF systems with full channel support from ICs to boards and beyond. The company serves multiple industries including military and aerospace, providing high-speed and rugged interconnect solutions with engineering support and extensive online tools. Headquartered in the United States, Samtec emphasizes fast engineering service, in-house manufacturing, and a broad portfolio of solution blocks for silicon-to-silicon and board-to-board connectivity.
Samtec is a manufacturer of electronic interconnect solutions, including connectors, cables, optics, and RF systems. The company serves industries such as military, aerospace, and computing by providing high-speed and rugged connectivity from ICs to boards. It supports customers with engineering assistance and online design tools.
Alpen-IO Inc.
1976
for_profit
active
Industries
Primary Industry: Manufacturing
Categories
Funding & Financials
series_unknown
200m-1b
private
Founders
Sam Shine
Leadership
Technology Stack
Products
High-Speed Board-to-Board Connectors: Connectors designed for high-speed data transmission between printed circuit boards, supporting data rates up to 112 Gbps PAM4 and PCIe 7.0 standards.
High-Density Array Connectors: Connectors with dense pin configurations and various pitches and stack heights, designed for maximum routing and grounding flexibility in high-speed applications.
Flyover® Cable Systems: Cable assemblies designed to route high-speed signals over circuit boards, reducing signal loss and enabling flexible system architectures.
Optical Transceiver Solutions: Mid-board optical transceiver products that provide signal transmission over extended distances for chip-to-chip and system-to-system connectivity.
Edge Card Connectors: Connectors for edge card interfaces supporting various pitches and orientations, used in data communication and industrial applications.
Ultra Micro Interconnects: Fine pitch, low profile interconnects designed for compact electronic assemblies with high-speed performance up to 56 Gbps PAM4.
