Engineer, Packaging Developing Engineering

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Engineer, Packaging Developing Engineering

Sandisk

Location

Shanghai, Shanghai, China

Experience

Mid

Posted

Jul 30, 2026

Apply by

August 29, 2026

Applicants

0

Early applicantEasy applyFull-timeWork from Office

Job Description

## Company Description Sandisk understands how people and businesses consume data and we relentlessly innovate to deliver solutions that enable today’s needs and tomorrow’s next big ideas. With a rich history of groundbreaking innovations in Flash and advanced memory technologies, our solutions have become the beating heart of the digital world we’re living in and that we have the power to shape. Sandisk meets people and businesses at the intersection of their aspirations and the moment, enabling them to keep moving and pushing possibility forward. We do this through the balance of our powerhouse manufacturing capabilities and our industry-leading portfolio of products that are recognized globally for innovation, performance and quality. Sandisk has two facilities recognized by the World Economic Forum as part of the Global Lighthouse Network for advanced 4IR innovations. These facilities were also recognized as Sustainability Lighthouses for breakthroughs in efficient operations. With our global reach, we ensure the global supply chain has access to the Flash memory it needs to keep our world moving forward. ## Job Description - SIP assembly process and packaging engineer, BGA/LGA products packaging, especially for molding process. - Develop and optimize new process recipes to achieve high capability for future products. - Evaluate and introduce advanced packaging process technology. - Collaborate with material/equipment team to develop new material/equipment technology. - Work with the global team on new product design, evaluation, and introduction. - Partner with the Pathfinding team to achieve leading PKG technology targets. ## Qualifications REQUIRED: - Master or above, major in Organic Materials Science and Engineering, materials chemistry, etc. - Good communication skill and team work spirit, willing to work under certain pressure. PREFERRED: - Strong Knowledge at SIP packaging. - Good at AutoCAD, 3D drawing, Animations, Solidworks, JMP (Or other similar statistic software, Spot-fire) etc. - Familiar with one of programming language will be a plus. SKILLS: - Good communication skill at both Chinese and English. ## Additional Information Sandisk thrives on the power and potential of diversity. As a global company, we believe the most effective way to embrace the diversity of our customers and communities is to mirror it from within. We believe the fusion of various perspectives results in the best outcomes for our employees, our company, our customers, and the world around us. We are committed to an inclusive environment where every individual can thrive through a sense of belonging, respect and contribution. Sandisk is committed to offering opportunities to applicants with disabilities and ensuring all candidates can successfully navigate our careers website and our hiring process. Please contact us at jobs.accommodations@sandisk.com to advise us of your accommodation request. In your email, please include a description of the specific accommodation you are requesting as well as the job title and requisition number of the position for which you are applying.

Key Responsibilities

  • Manage SIP assembly processes and packaging for BGA/LGA products, particularly molding.
  • Develop and optimize new process recipes to achieve high capability for future products.
  • Evaluate and introduce advanced packaging process technology.
  • Collaborate with material and equipment teams to develop new technologies.
  • Work with the global team on new product design, evaluation, and introduction.
  • Partner with the Pathfinding team to achieve leading packaging technology targets.

Requirements

  • Master's degree in Organic Materials Science and Engineering
  • materials chemistry
  • or related field

Skills Required

SIP assemblyBGA/LGA packagingMolding processProcess recipe optimizationAdvanced packaging technologyCommunicationTeamworkAbility to work under pressureAutoCAD3D drawingAnimationsSolidworksJMPStatistical softwareSpot-fireProgramming languages

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