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  3. Senior Equipment Engineer (...

Senior Equipment Engineer (Wire Bond)

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Renesas Electronics Corporation logo

Senior Equipment Engineer (Wire Bond)

Renesas Electronics Corporation

Location

Bayan Lepas, , Malaysia

Experience

Senior

Posted

Jul 10, 2026

Apply by

August 9, 2026

Applicants

0

Early applicantEasy applyFull-timeWork from Office

Sign in to apply on web or download the app for more options.

Job Description

## Job Description Responsible for driving wire bonding equipment performance and reliability to meet production targets. The role focuses on improving Overall Equipment Effectiveness (OEE), and minimizing unplanned downtime (UDT). This includes planning maintenance strategies, leading troubleshooting activities, and collaborating cross-functionally to ensure stable and efficient equipment operation. Key Responsibilities - Drive and improve equipment performance metrics (OEE, MTBC, UDT) - Lead troubleshooting and root cause analysis for equipment-related issues - Plan and optimize preventive maintenance strategies and schedules - Monitor equipment performance trends and drive improvement initiatives - Collaborate with production, process, and vendors to implement effective solutions - Coach and guide technicians on technical problem-solving and best practices ## Qualifications - Bachelor’s Degree in Engineering (Mechanical / Electrical / Mechatronics / Manufacturing) - Minimum 6 years’ experience in semiconductor equipment maintenance (wire bond preferred) - Strong troubleshooting and root cause analysis capability - Solid understanding of equipment performance metrics (OEE, MTBC, downtime analysis) - Good leadership and cross-functional communication skills Good to have - Experience with wire bonding equipment (E.g. Shinkawa UTCx000 series, K&S Iconn) - Familiar with structured problem-solving methodologies - Experience in equipment reliability and optimization projects - Hands-on experience in equipment troubleshooting and validation - Ability to prepare clear, structured, and comprehensive technical reports - Knowledge in automation, vision systems, and predictive maintenance approaches ## Additional Information Renesas is an embedded semiconductor solution provider driven by its Purpose ‘To Make Our Lives Easier.’ As the industry’s leading expert in embedded processing with unmatched quality and system-level know-how, we have evolved to provide scalable and comprehensive semiconductor solutions for automotive, industrial, infrastructure, and IoT industries based on the broadest product portfolio, including High Performance Computing, Embedded Processing, Analog & Connectivity, and Power. With a diverse team of over 21,000 professionals in more than 30 countries, we continue to expand our boundaries to offer enhanced user experiences through digitalization and usher into a new era of innovation. We design and develop sustainable, power-efficient solutions today that help people and communities thrive tomorrow, ‘To Make Our Lives Easier.’ At Renesas, you can: - Launch and advance your career in technical and business roles across four Product Groups and various corporate functions. You will have the opportunities to explore our hardware and software capabilities and try new things. - Make a real impact by developing innovative products and solutions to meet our global customers' evolving needs and help make people’s lives easier, safe and secure. - Maximize your performance and wellbeing in our flexible and inclusive work environment. Our people-first culture and global support system, including the remote work option and Employee Resource Groups, will help you excel from the first day. Are you ready to own your success and make your mark? Join Renesas. Let’s Shape the Future together. Renesas Electronics is an equal opportunity and affirmative action employer, committed to supporting diversity and fostering a work environment free of discrimination on the basis of sex, race, religion, national origin, gender, gender identity, gender expression, age, sexual orientation, military status, veteran status, or any other basis protected by law. For more information, please read our [Diversity & Inclusion Statement](https://jobs.renesas.com/diversity-and-inclusion).

Key Responsibilities

  • Drive and improve equipment performance metrics such as OEE, MTBC, and UDT
  • Lead troubleshooting and root cause analysis for equipment-related issues
  • Plan and optimize preventive maintenance strategies and schedules
  • Monitor equipment performance trends and drive improvement initiatives
  • Collaborate with production, process, and vendors to implement effective solutions
  • Coach and guide technicians on technical problem-solving and best practices

Requirements

  • Bachelor’s Degree in Engineering (Mechanical / Electrical / Mechatronics / Manufacturing)

Skills Required

Wire bonding equipment maintenanceOEEMTBCDowntime analysisRoot cause analysisPreventive maintenanceTroubleshootingLeadershipCross-functional communicationWire bonding equipmentShinkawa UTCx000 seriesK&S IconnStructured problem-solving methodologiesEquipment reliabilityEquipment optimizationEquipment troubleshootingValidationAutomationVision systemsPredictive maintenanceAbility to prepare clear, structured, and comprehensive technical reports

Benefits

  • Remote work option
  • Employee Resource Groups
  • Flexible and inclusive work environment
  • Global support system

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Job Overview

Salary

—

Job Type

Full-time

Experience

Senior

Location

Bayan Lepas, , Malaysia

Application Deadline

August 9, 2026

Total Applicants

0

About Renesas Electronics Corporation

Renesas Electronics Corporation logo

Renesas Electronics Corporation is a leading company in the Technology sector, known for innovation and employee-centric culture.

View Company

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