Principal Digital Design Engineer
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Renesas Electronics CorporationGet Smart Job AI Coach in the appFree on iOS and Android 






Principal Digital Design Engineer
190,000–240,000 / Year
Location
San Jose, CALIFORNIA, United States
Experience
Senior
Posted
Jul 22, 2026
Apply by
August 21, 2026
Applicants
0
Early applicantEasy applyFull-timeHybrid
Job Description
## Job Description
Renesas is a global semiconductor company providing hardware and software solutions for various cutting-edge technologies including self-driving cars, robots, automated factory equipment, and smart home applications. We are a key supplier to the world's leading manufacturers of electronics you rely on every day; you may not see our products, but they are all around you. Renesas is a global, multi-billion dollar, a publicly traded company headquartered in Japan, and has subsidiaries in 20 countries worldwide. Renesas is a dynamic, multicultural technology company where employees learn, mentor, innovate and thrive. Renesas is extending our share in fast-growing data economy-related markets such as infrastructure and data centers and strengthening our presence in the industrial/IoT and automotive segments. Our solutions drive products developed by major innovators around the world. Join us and build your future by being part of what's next in electronics.
This is a Principal Digital Engineer position for a qualified individual to work in Renesas' Analog and Mixed Signal Business Group. The primary role is to architect, design and implement the digital and mixed signal IC. The candidate will work together with the team in the other sites of United State and the team in China and contribute to all aspects of development from product conception to production release. The Candidate should have experience in architecting and leading the development, with a proven track record of delivering high-quality silicon on time and within cost targets. The candidate will also be responsible for design documentation, silicon evaluation, circuit debugging, production test development support, and customer and applications support. He/she will also be involved in the specification of technology requirements for future products.
## Qualifications
- Education: MSEE or PH.D. in Electrical Engineering with 8+ years of relevant industry experience, or BSEE in Electrical Engineering with 12+ years of relevant industry experience
- Proven experience in SOC architecture, AHB/APB/AXI, bus matrix and interface protocols – USB, I2C/I3C, SPI, UART; packet-oriented protocols.
- Good knowledge of embedded memories – SRAM, OTP, MTP and EE/Flash memory
- Good knowledge of design flow. Hands on in chip architecture definition, Partition, assignment, RTL coding, simulation, synthesis, DFT and timing check
- Strong Communication and Teamwork Skills
- Highly Motivated and Creative Individuals
- AI Savvy and leveraging AI in daily work
- Bilingual and Mandarin fluency would be a plus
- DDR DRAM and Flash memory knowledge would be a plus
- Mixed signal knowledge and mixed-signal chip development experience is highly preferred.
- Project management skills are highly preferred
## Additional Information
The expected annual pay range for this position is $190K- $240K. This position is also eligible for bonus opportunities. Please note that final offer amount will be dependent on geographic location, applicable experience, and skillset of the candidate.
Renesas offers a full range of elective benefits including medical, health savings account (with applicable medical plan), dental, vision, health and/or dependent care flexible spending accounts, pre-tax commuter benefits, life insurance, AD&D, and pet insurance. In addition to elective benefit options, benefited employees receive company-paid life insurance and AD&D, LTD, short term medical benefits as well as paid sick time, paid holidays, and accrued paid vacation. New employees will attend a detailed benefit orientation to learn more about our many benefits and resources
Renesas is an embedded semiconductor solution provider driven by its Purpose, To Make Our Lives Easier. With a global team of over 21,000 engineers and problem solvers in more than 30 countries, we offer the opportunity to work on world‑leading technology for Automotive, Industrial, Infrastructure, and IoT, shaping a safer, healthier, greener, and smarter future.
At Renesas, TAGIE is our culture, grounded in being Transparent, Agile, Global, Innovative, and Entrepreneurial. It shapes how we work, grow and deliver on our purpose together. This collaborative spirit and mindset drive our semiconductor technology to transform industries and impact millions of lives.
We believe in rewarding our employees with a competitive benefits package alongside their salary. More information will be provided during the hiring process.
Are you ready to join our team and shape the future with us?
Renesas Electronics is an equal opportunity and affirmative action employer, committed to supporting diversity and fostering a work environment free of discrimination on the basis of sex, race, religion, national origin, gender, gender identity, gender expression, age, sexual orientation, military status, veteran status, or any other basis protected by law. For more information, please read our [Diversity & Inclusion Statement](https://jobs.renesas.com/diversity-and-inclusion).
Renesas Electronics deals with dual-use technology that is subject to U.S. export controls regulations. Under these regulations it may be necessary for Renesas to obtain U.S. government export license prior to release of technology to certain persons. The decision whether or not to file or pursue an export license application is at the sole discretion of Renesas.
Key Responsibilities
- Architect, design, and implement digital and mixed-signal ICs
- Lead development from product conception to production release
- Perform design documentation, silicon evaluation, and circuit debugging
- Support production test development and customer applications
- Specify technology requirements for future products
- Collaborate with teams in the US and China
Requirements
- MSEE or PH.D. in Electrical Engineering with 8+ years of relevant industry experience
- BSEE in Electrical Engineering with 12+ years of relevant industry experience
Skills Required
SOC architectureAHB/APB/AXIBus matrixInterface protocols (USB, I2C/I3C, SPI, UART)Packet-oriented protocolsEmbedded memories (SRAM, OTP, MTP, EE/Flash)Chip architecture definitionPartitionAssignmentRTL codingSimulationSynthesisDFTTiming checkCommunicationTeamworkMotivationCreativityMixed signal knowledgeMixed-signal chip developmentDDR DRAMFlash memoryAI toolsProject managementBilingualMandarin fluency
Benefits
- Medical insurance
- Health savings account
- Dental insurance
- Vision insurance
- Flexible spending accounts
- Pre-tax commuter benefits
- Life insurance
- AD&D insurance
- Pet insurance
- Company-paid life insurance
- Long-term disability
- Short-term medical benefits
- Paid sick time
- Paid holidays
- Accrued paid vacation
- Bonus opportunities
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