Staff Semiconductor Thin Films Process Engineer, Raxium
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Staff Semiconductor Thin Films Process Engineer, Raxium
188,000–275,000 / Year
Location
Fremont, CA, USA
Experience
Senior
Posted
Jul 22, 2026
Apply by
August 21, 2026
Applicants
0
Early applicantEasy applyFull-timeWork from Office
Job Description
Minimum qualifications: Bachelor’s degree in Electrical Engineering, Computer Engineering, Computer Science, Physics, or a specialized field (e.g., Optics, Sensors, Audio/DSP, etc.), or equivalent practical experience. 5 years of experience in the semiconductor industry maintaining equipment, such as ICP, PVD, or CVD. Experience with conventional microfabrication techniques, including lithography, etch, thin-film deposition, and metrology. Experience with data analysis and reporting. Preferred qualifications: Master's degree or PhD in Electrical Engineering, Computer Engineering, Physics, or a related field (e.g., Optics, Sensors, Audio/DSP). Experience in data analysis in quality reliability (tools like JMP). Experience with microdisplay or microLED technology. Understanding of statistical process control and process improvement, including implementation experience.
About the job Google's Raxium display group has established a revolutionary semiconductor materials display technology that enables new functionality in display products, bringing to users a closer and more natural linkage between the digital and physical realms in applications such as augmented reality (AR) and light-field display. With start-up roots and a state-of-the-art compound semiconductor fab in Silicon Valley, Raxium is seeking to build upon its engineering team with an aim to disrupt next-generation display markets. Individual pay is determined by factors including job-related skills, experience, and relevant education or training. US: $188000 - $275000 (USD) + 20% bonus target + equity + benefits Learn more about benefits at Google.
Responsibilities Develop and sustain new processes associated with thin film deposition tools including sputtering, PECVD, e-beam, PVD, and others. Manage process control and defectivity reduction to deliver yield improvements. Work with the Process Engineering team to select our next generation of tools needed for volume manufacturing. Collaborate with the Integration team to develop new process capabilities that address new design requirements.
Key Responsibilities
- Develop and sustain new processes for thin film deposition tools including sputtering, PECVD, e-beam, and PVD.
- Manage process control and defectivity reduction to deliver yield improvements.
- Collaborate with the Process Engineering team to select next-generation tools for volume manufacturing.
- Work with the Integration team to develop new process capabilities addressing new design requirements.
Requirements
- Bachelor’s degree in Electrical Engineering
- Computer Engineering
- Computer Science
- Physics
- or a specialized field
Skills Required
ICPPVDCVDLithographyEtchThin-film depositionMetrologyData analysisReportingJMPMicrodisplay technologyMicroLED technologyStatistical process controlProcess improvement
Benefits
- 20% bonus target
- Equity
- Benefits
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